Electrical Components
 

Electronic Components

    FPC

    Multi-Layer FPC

    The multi-layer FPC has three (3) or more conductive layers. Integrated high-density packaging with multiple conductive layers allows for circuit routing used with high pin-count component assemblies.

    Multi-Layer FPC1

    Features
    • High reliability and space-saving is achieved by eliminating coupling parts such as connectors.
    • Various types of FPCs are possible through our innovative construction technique of partial multi-layering to utilize the most of FPC properties (flexibility).
    • We are now developing a unique APIC (All Polyimide IVH Colaminated) multi-layer FPC for high-density applications.

    Applications
    • Electrical wiring for DSCs, DVCs and laptop PCs
    • Mobile phones
    • Camera modules, etc.

    Specifications
    • Fine line/space circuit
    • Low spring-back
    • Microsize VIA hole (LVH: Laser Via Hole, IVH: Inner Via Hole)
    • Board-to-board interconnection
    • Dynamic feature
    • Electrical noise (EMI) shield
    • High-speed signal transmission (Impedance control)
    • Environmentally friendly (Halogen-free)
    • Flame resistant (UL Standards)

    Other configurations are available; please feel free to contact us for details.

    Structure
    Multi-Layer FPC Structure

    Material Thickness (μm)
    Resist film Polyimide 12, 25
    Adhesive Thermal curing type Various thickness
    Cu plating - More than 15
    Cu foile Electrolytic/rolled type 12, 18
    Adhesive Thermal curing type Various thickness
    Base film Polyimide 12, 25
    Adhesive Thermal curing type 25
    Resist film Polyimide 12, 25
    Adhesive Thermal curing type Various thickness
    Cu plating - More than 4
    Cu foil Electrolytic/rolled type 12, 18
    Adhesive Thermal curing type Various thickness
    Base film Polyimide 12, 25
    Adhesive Thermal curing type Various thickness
    Cu foil Electrolytic/rolled type 12, 18
    Cu plating - More than 4
    Adhesive Thermal curing type Various thickness
    Resist film Polyimide 12, 25
    Adhesive Thermal curing type 25
    Base film Polyimide 12, 25
    Adhesive Thermal curing type Various thickness
    Cu foil Electrolytic/rolled type 12, 18
    Cu plating - More than 15
    Adhesive Thermal curing type Various thickness
    Resist film Polyimide 12, 25

    * The standard composition is shown above.
    (Other types are also available; please contact us for details.)

    Multi-Layer FPC 2