Heat pipe is a heat transfer device which uses the latent heat of evaporation and condensation to achieve high thermal conductance with a small temperature difference. Fujikura can provide cooling modules consisted of heat spreaders, heat sinks and fans.
Fujikura has developed a high performance heat sink through aluminum extrusion molding and snap-fin technologies, which realizes fins with high aspect ratios (thickness of the fins is extremely smaller than the height). This type of heat sink is used in many kinds of cooling modules for PC and server CPUs, as well as telecommunication equipment. It can also be integrated with heat pipes and rotary fans.